ASTM D2020 / UMA 6006

Assessment of the fungal resistance of paper, paperboard and comparable cellulose-based materials using a test method based on ASTM D2020.

Overview

ASTM D2020 / UMA 6006 is used to assess the resistance of paper, paperboard and comparable cellulose-based materials to fungal growth.

The method is suitable for assessing mould resistance, fungal resistance and microbial surface colonisation of paper and paperboard materials. Evaluation is qualitative.

Test parameters such as sample type, test fungi, incubation conditions and evaluation period can be agreed for the specific project, depending on the material and testing objective.

Typical applications

Paper & paperboard

For paper and paperboard materials whose resistance to fungal growth is to be assessed.

Packaging materials

For cellulose-based packaging or cardboard materials that may be exposed to moisture and microorganisms.

Material development

For assessing and comparing material variants, finishes or treatments in terms of mould resistance.

Frequently asked questions

What is ASTM D2020 / UMA 6006 suitable for?

The method is suitable for assessing the fungal resistance of paper, paperboard and comparable cellulose-based materials.

Does the test assess antibacterial activity?

No. The focus is on assessing fungal growth and mould resistance. Other test methods are more suitable for assessing antibacterial activity.

How are the results evaluated?

Evaluation is qualitative, for example based on visible fungal growth or microbial colonisation of the tested material.

Can the test conditions be adapted?

Yes. The sample type, test fungi, incubation conditions, test duration and evaluation can be agreed for the specific project, depending on the material and testing objective.

Which materials can be tested?

Typical test materials include paper, paperboard, cardboard and comparable cellulose-based materials. The suitability of a specific material depends on the sample structure, testing objective and question being investigated.